laser process equipment

characteristic

Adapt to multiple frequency bands and have strong process adaptability

UV 355nm, visible 532nm, near-infrared 1064nm and other wavelength bands can be selected
Centered around research and development purposes, the corresponding wavelength band can be selected based on the absorption wavelength of the workpiece

By controlling laser pulses at high speed, uniform processing can be achieved

Stable pulse energy and pulse interval through constant velocity control
Using self-developed first pulse control to achieve rapid launch

Narrow pulse width reduces heating effects

The compact YVO4 laser can emit with a pulse width of 10nsec, reducing its impact and damage to the substrate.

High precision pattern formation within the range of 200mm × 200mm

Digital encoder type galvanometer scanner achieves high-precision positioning
Three dimensional control eliminates optical aberrations while balancing a wide scanning area with small targets.

Processing examples

Application examples

Laser pattern formation of various electrodes on glass film substrates or substrates

ITO、 Transparent conductive films such as silver nanowires and CNTs, or conductive paste electrodes such as silver paste

Film laser cutting

High quality processing that can effectively control the thermal effects on various thin film materials.