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CubeII
I-CubeII Inverted Soldering Machine Hybrid Mounting Equipment [Universal Inverted Soldering Machine, Chip Soldering Machine] can mix SMD components an
Product details
Description
Specification
| i-CubeⅡ | ||
|---|---|---|
| Object size | L30×W30mm(Min)～L300×W200mm(Max) | |
| Mounting accuracy (Our company uses standard components for evaluation) |
F-head specification | Absolute accuracy (μ+3 σ): ± 20 μ m, repeatability accuracy (3 σ): ± 12.5 μ m |
| 4M head specification | Absolute accuracy (μ+3 σ): ± 30 μ m, repeatability accuracy (3 σ): ± 20 μ m | |
| Installation/spraying efficiency (Best conditions) ※ Excluding processing time) |
4M head specification | 0.5 seconds/CHIP (continuous suction) |
| FF head specifications | 0.8 seconds/CHIP (for belt and tray supply) 1.3 seconds/CHIP (for chip supply) | |
| FD head specifications | It varies depending on the process. Please consult separately. | |
| Overall dimensions | L1,350xW1,408xH1,850mm | |
- Please consult for detailed information.
- Specifications and appearance are subject to change without prior notice.
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