Component 2
Measurement requirements
Scan the three-dimensional surface morphology of electronic components, extract profiles, and measure the required positional differences on their surfaces
Overview of Main Features
1. Non contact measurement, integrated design
2. Three dimensional morphology scanning and multifunctional data processing
3. Suitable for precise measurement of various materials
4. Easy to use and convenient to assemble and disassemble
5. Fast scanning speed and high positioning accuracy
6. Repetitive accuracy guarantee from ± 0.5 to ± 1 μ m
7. High stability and strong anti-interference ability


measurement results
The measured position difference is about 320 μ m
Addressing the current issues with measuring devices
1. There are certain requirements for measuring materials
2. Contact measurement may cause damage to the measuring material
3. The measurement range is small, the position is uncertain, and the measurement is difficult
4. Slow measurement speed, low accuracy, and large measurement errors
5. Complex structure and high cost
