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Using fiber laser, stable beam quality and performance;
Equipped with a precision cutting head, small focusing spot, and excellent cutting effect;
The equipment is equipped with an optical marble platform, precision linear motor, and negative pressure adsorption system, ensuring accurate positioning and high processing stability.
Suitable materials include sapphire, ceramics, silicon wafers, and brittle materials.
model
Model
CL-FSC150Q
CL-FSC300Q
Single pulse energy
Max.Single Pulse Power
15J
30J
Average power (continuous mode)
Max. Average Power
150W
300W
peak power
Maximum Pulse Energy
1500W
3000W
Laser wavelength (nm)
Laser Wavelength
1070
Pulse width (MS)
Pulse Width
0.2~50
way of working
Working Mode
Pulse/Continuous
Pulse/continuous
Motion Platform
precision linear motor
Processing format
400 * 400 (customizable)
Size of collapsed edge
<30 μ m (depending on the material)
positioning
Red light/CCD visual positioning (optional)
conicity
<2°
Cutting thickness
≤ 2mm (depending on the material)
Cutting efficiency
5-20mm/s (depending on the material)
dimensional accuracy
±20μm
Cooling method
Cooling
forced air cooling
power supply
Power Suppy
220V±10% 50HZ
Application areas: Suitable for cutting sapphire mobile phone panels and lens covers, ceramic panels and other components, silicon and other materials.
Successful operation!