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Orbital online vacuum plasma cleaning ..
Product Introduction: Used in the LED/chip packaging industry
Product details
Product features:
For the design of LED and IC packaging processes, four different widths of products can be cleaned simultaneously;
The number of tracks can be increased or decreased, or can be flexibly designed according to the width of the material;
Chip cleaning, the cleaning effect is more obvious and thorough;
Single side loading and unloading structure, no need to replace the material box, the cleaned product automatically returns to the original material box, eliminating batch mixing;
Highly automated operation, equipped with functions such as automatic loading, transmission, cleaning, and receiving, reducing personnel intervention and lowering the risk of secondary pollution.
Double cleaning trays, one for cleaning and the other for material preparation, improve production efficiency;
One click product replacement, all parameters and settings of the device are automatically loaded, without the need for manual settings;
Both manual and automatic cleaning are operated with one click, making it easier to operate and use;
Multiple product safety designs ensure personal safety and prevent product deformation and damage;
Modular design and international brand configuration ensure stable operation of the equipment.
Modular design, flexible component replacement, fast product switching, real-time monitoring of operation process, animated indication of work process, clear at a glance, hierarchical management of equipment operation permissions, easy to control.
Using a 13.56MHz power supply, the cleaning time is short, there is no sputtering, and the temperature is low.
Each of the 4 channels is independently tested to accurately identify the problem, the production process can be controlled, fault alarms can be traced, and there are prompts to quickly troubleshoot the faulty area for easy maintenance
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