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Ion grinder IM4000II
The standard model IM4000 II of Hitachi ion grinder can perform both cross-sectional and planar grinding. Various optional functions such as low-tempe
Product details
Ion grinder IM4000II
The standard model IM4000 II of Hitachi ion grinder can perform both cross-sectional and planar grinding. Various optional functions such as low-temperature control and vacuum transfer can also be used to grind cross-sections for different samples.
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characteristic
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Optional items
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specifications
characteristic
Efficient section grinding
IM4000II is equipped with a cross-sectional grinding capacity of 500 µ m/h*1The high-efficiency ion gun mentioned above. Therefore, even hard materials can efficiently prepare cross-sectional samples.
- *1
- At an acceleration voltage of 6 kV, protrude the Si sheet 100 µ m from the edge of the shielding plate and process it for 1 hour to the maximum depth
Sample: Si sheet (2mm thick)
Acceleration voltage: 6.0 kV
Swing angle: ± 30 °
Grinding time: 1 hour
If the swing angle changes during section grinding, the width and depth of the processed area will also change. The following figure shows the results of cross-section grinding of Si sheet at a swing angle of ± 15 °. Except for the swing angle, all other conditions are consistent with the above processing conditions. After comparing with the above results, it can be found that the depth of processing has increased.
For samples with observation targets located deep, faster cross-sectional grinding can be performed on the samples.
Sample: Si sheet (2mm thick)
Acceleration voltage: 6.0 kV
Swing angle: ± 15 °
Grinding time: 1 hour
Composite grinder
Section grinding
- Even composite materials composed of materials with different hardness and grinding speeds can be prepared with smooth grinding surfaces using IM4000 II
- Optimize processing conditions to reduce sample damage caused by ion beams
- Can load samples up to 20 mm (W) x 12 mm (D) x 7 mm (H)
The main purpose of cross-sectional grinding
- Cross section preparation of metal, composite materials, polymer materials and other samples
- Preparation of sample cross-sections containing specific locations such as cracks and voids
- Cross section preparation of multi-layer samples and pretreatment for EBSD analysis of samples
plane lapping
- Uniform machining within a diameter range of approximately 5mm
- Widely applicable in various fields
- Maximum load capacity for samples with a diameter of 50 mm and a height of 25 mm
- Two processing methods are available: rotation and swing (± 60 degrees, ± 90 degrees swing)
The main use of flat grinding
- Remove small scratches and deformations that are difficult to eliminate in mechanical grinding
- Remove the surface layer of the sample
- Eliminate the damage layer caused by FIB processing
Optional items
Low temperature control function*1
Fill liquid nitrogen into a Dewar jar as a cooling source to indirectly cool the sample. IM4000 II is equipped with temperature regulation control function to prevent resin and rubber samples from overcooling.
- *1 needs to be ordered simultaneously with the host.
Room temperature grinding
Cooling grinding (-100 ℃)
- Sample: Functional (paper) isolation material to reduce plastic usage
Vacuum transfer function
The sample processed by ion milling can be directly transferred to SEM without contact with air*1、 AFM*2Up there. The vacuum transfer function and low-temperature control function can be used simultaneously. The flat grinding vacuum transfer function is not applicable to the low-temperature control function.
- *Only supports Hitachi FE-SEM with vacuum transfer exchange chamber
- *Only supports vacuum type Hitachi AFM.
A stereomicroscope for observing the processing process
The image on the right shows a stereomicroscope used to observe the sample processing process. A three eye microscope equipped with a CCD camera can observe on a display. Binocular stereomicroscope can also be configured.
specifications
| Main Content | |
|---|---|
| Using Gas | argon |
| Argon flow control method | mass flow control |
| Accelerating Voltage | 0.0 ～ 6.0 kV |
| size | 616(W) × 736(D) × 312(H) mm |
| weight | Main engine 53 kg+mechanical pump 30 kg |
| Section grinding | |
| Fastest grinding speed (Si material) | 500 µm/h*1the above |
| Maximum sample size | 20(W）×12(D）×7（H）mm |
| Sample movement range | X ± 7 mm, Y 0~+3 mm |
| Intermittent processing function of ion beam Range of opening/closing time settings |
1 second to 59 minutes and 59 seconds |
| Swing angle | ± 15 °, ± 30 °, ± 40 ° |
| Wide area cross-sectional grinding function | - |
| plane lapping | |
| Maximum processing range | φ32 mm |
| Maximum sample size | Φ50 X 25 (H) mm |
| Sample movement range | X 0～＋5 mm |
| Intermittent processing function of ion beam Range of opening/closing time settings |
1 second to 59 minutes and 59 seconds |
| rotational speed | 1 rpm、25 rpm |
| Swing angle | ± 60 °, ± 90 ° |
| Tilt angle | 0 ～ 90° |
- *1. Highlight the Si sheet 100 µ m from the edge of the shielding plate and process it to a depth of 1 hour.
Optional items
| project | content |
|---|---|
| Low temperature control function*2 | Indirectly cool the sample using liquid nitrogen, with a temperature setting range of 0 ° C to -100 ° C |
| Super hard shielding board | The usage time is about twice that of the standard shielding plate (excluding cobalt) |
| Observation of Processing Process with Microscope | Magnification factor of 15 ×~100 × for binocular and trinocular models (can be equipped with CCD) |
- *2 needs to be ordered simultaneously with the host. The cooling temperature control function may have limited usage for some functions during use.
Related product classification
- Field emission scanning electron microscope (FE-SEM)
- Scanning Electron Microscope (SEM)
- Transmission Electron Microscopy (TEM/STEM)
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