Xiangtan Huafeng Instrument Manufacturing Co., Ltd
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    13607325732,13054147660
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    No. 172 Ping'an Road, Pioneer Group, Yuhu District, Xiangtan City
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Intelligent flat plate thermal conductivity tester for insulation materials
This instrument is mainly used to test the thermal conductivity of solid materials such as building engineering thermal insulation materials, thermal
Product details

DRX-II-300A Intelligent Flat Thermal Conductivity Tester for Insulation Materialstesting materialsIncluding fiberboard, loose filled glass fiber, ceramic fiber, (XPS/EPS/PUR, etc.) foam plastic, interlayer composite board, vacuum board, rubber products, cement products, powder materials, filling materials, gypsum board, etc. Compliant with the national standard GB/T 10294-2008 Protection Hot Plate Method, ASTM C 518, ISO 8302 and other testing standards, in the originalDRX-I- PCThe dual tablet instrument technology has undergone significant improvements and upgrades,Equipped with triple temperature protection, it minimizes environmental thermal interference to the greatest extent possible. The test piece and the hot and cold plates can achieve automatic parallel adjustment, with minimal non parallel error on both sides of the test piece. The cold surface has electronic refrigeration technology and other refrigerants such as water medium for users to choose from, stable temperature control technology, computer interface, real-time software measurement and control, data processing and storage technology, etc., which meets the requirements of national standards for thermal conductivity measurement. Applied to material performance testing institutions, scientific research institutions (institutes), factory quality testing departments, and teaching and research in higher education institutions.

DRX-II-300A Intelligent Flat Thermal Conductivity Tester for Insulation Materials Main Technical Specifications:

(1) Configurable online real-time thickness measurement and reading device, eliminating the need for manual measurement of specimens.

(2) Configurable real-time online detection, display, and regulation of specimen pressure

(3) Built in dual panel structure design and insulation technology, circuit design with high-precision temperature detection and compensation functions.

(4) Built in fuzzy PID protective plate - hot plate temperature tracking and precision control technology

(5) Self calibration function for thermal conductivity and heating power

(6) Compensation function for specimen thickness and average temperature

(7) A fully automatic thermal analysis measurement software system with WINDOWS operating interface, featuring data analysis and report output functions.

(8) The thickened thermal conductivity meter can measure the thermal conductivity of thickened specimens, with the largest specimen thickness reaching up to 200mm.

(9) Power supply voltage: AC 220V ± 5%, power: 3.0kW

(10) Measurement range of thermal conductivity: 0.01~2.2 W/ m·K,

Measurement repeatability: ± 1.0%, measurement accuracy: ± 2.5%

(11) Temperature measurement range: The lowest cold plate temperature is -40 ℃, and the lowest set temperature for the cold plate is:- 40~60℃

(12) Hot plate setting temperature: Room temperature~110 ℃, 300 ℃, 600 ℃ (optional),

The lowest temperature for cold noodles: -10 ℃ -20 ℃, -40 ℃ (optional); Temperature control accuracy: 0.1℃

Temperature measurement accuracy: 0.1 ℃ Temperature resolution: 0.01℃

Cold face refrigeration: electronic semiconductor refrigeration, compressed air cooling, cooling water refrigeration, ethanol medium compressor refrigeration methods to choose from

(13) Environmental conditions: Room temperature: 18-25 ℃, humidity: 20-80% RH

(14) Requirements for flat test specimens:

Standard thickness: Conventional thermal conductivity meter: 25 ± 1 mm (recommended by national standards), maximum up to 50 mm

Thickened thermal conductivity meter: 60-100 mm, with the largest reaching up to 200 mm,

Flatness:< 0.5mm, hardness: suitable for various related hard materials, and can also be measured for related soft materials,

Powder sample requirements: No special requirements. Can be paired with a powder testing device box.

(15) Temperature control accuracy: Hot plate (± 0.1 ℃) Cold plate (± 0.1 ℃)

(16) Sample size requirements (mm): 200 × 200 × (5-20), 300 × 300 × (5-100),

500×500×(5-100),1000×1000×(5-100),

(17) Equipped with fully automatic thermal analysis software: Windows XP/s2 Chinese and English operating interface

This model comes in two types: horizontal and vertical. The appearance is for reference only and is subject to factory inspection

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