1、 Overview
The microphone array module (HP-DK60M) is a directional microphone array module designed and developed by Guangzhou Sizheng Electronics Co., Ltd. based on the circular array technology of 4-silicon microphone (MEMS). This board has vector output characteristics and can efficiently collect sound pressure and direction information of the sound field simultaneously. It can be applied to high-quality speech recognition, voiceprint recognition audio collection, and front-end audio processing systems. When high fidelity is required for sound quality, only pick up sounds within the target direction range and suppress sounds from non target directions. The structure of this single directional microphone module is simple, compact, and easy to integrate. The recommended optimal pickup distance for this module is within 3 meters.
2、 Structure diagram
HP-DK60M adopts a circular 4-micron array design and supports the UAC2.0 audio protocol; Supports Windows and iOS operating systems

3、 Module size
1. The overall size is 56mm * 38.5mm * 1.6mm.
2. Data transfer protocol: USB 2.0.

4、 Pick up direction and range angle
Identification of sound pickup hole: HP-DK60M uses a back inlet microphone, so the pickup surface should be the side without components. The sound pickup hole is shown in Figure 3 below

Pick up direction: The third microphone picks up sound in the M3 direction, as shown in Figure 4.
Pick up range: Based on the center of the microphone array, the plane is ± 45 °, and the pitch angle is 25 °.

Suppression of polarity: The polarity diagram measured at a frequency of 1KHz is shown in Figure 6, so the pickup range mentioned in the article is a reference range, and there is a certain attenuation transition section in actual pickup.

5、 Interface definition
The HP-DK60M module interface is connected through Type C, and the PCBA is shown in the following figure

6、 Precautions
1. When installing the finished structure, there should be sufficient space above the pickup surface for sound input, and it is recommended to have an open space without any sound insulation or obstruction;
2. The aperture D of the peripheral structure opening should be larger than the aperture d of the MEMS mic pickup hole, that is, D>d;
3. When assembling, the sound hole surface of the PCBA board should be tightly attached to the inner wall of the peripheral structural components, and the tighter the better, to avoid the formation of sound cavities. At least 2D>h is required.