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FD-9104PA Silicon Wafer Polishing Machine
Series: Silicon Wafer Grinding and Polishing Machine Product Model: FD-9104PA
Product details
FD-9104PA Silicon Wafer Polishing Machine
Main purpose:
Widely used for single-sided silicon wafers of various sizesPolishing and mirror polishing.
Equipment parameters:
|
Disc size for polishing |
Φ910mm |
|
Work station |
4 groups |
|
Ceramic suction cup diameter |
Φ400mm |
|
Way of Pressure |
Cylinder pressurization |
|
Main motor power |
7.5KW/380V |
|
Workpiece disk drive power |
0.4KW/380V |
|
Working pressure |
0.4-0.6MPa |
|
Workpiece disk speed |
5-40RPM |
|
Disc polishing speed |
10-80RPM |
|
Processing roughness |
Ra:0.0002 |
|
Total weight of equipment |
2300kg |
|
External dimensions（L*W*H） |
1650*1200*2300mm |
The effect of the ceramic polishing machine after polishing:
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