No heating, no pressure, no inlay machine required inlay material! Suitable for inlaying and non inlaying places where samples cannot be heated, saving equipment investment and energy consumption, while also not worrying about sample softening due to high inlaying temperature tempering and internal structural changes caused by heating.
Especially suitable for embedding micro slice samples in the electronics industry.
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CM1 Cold Inlay King |
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CM1SE Cold Inlay King |
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CM2 Crystal King Packaging: 1000ml liquid resin+50ml curing agent Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and 40 mixing rods each Transparent as crystal. Curing time: 25 ℃ for 30 minutes Suitable for various materials, especially in the electronic industry such as PCB and SMT. |
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CM3 Quick Epoxy King (Quick Drying Type) |
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CM4 low viscosity epoxy king |
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CM6 Low Heat Epoxy King Packaging: 4L resin liquid/bottle+1200ml curing agent Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and 40 mixing rods each Epoxy resin, with minimal shrinkage, low heat generation, completely transparent, and odorless. Curing time: 25 ℃ for 20-24 hours Suitable for various materials, especially in the electronic industry such as PCB and SMT. |
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CM7 UV curable resin Components: 1000ml liquid+100ml multi-layer varnish+4g repair paste Only cured under blue light irradiation, without harmful ultraviolet rays All resins are used in composites without the need for special mixing Extended storage time as aggregation only occurs under blue light By using appropriate radiation methods, the temperature can be lowered to about 50 ℃ or lower Bubble free transparent composite that can resist alcohol and acid Suitable for scanning electron microscopy testing, odorless |







