H-II (Constant Power Plane Heat Source Method) Intelligent Thermophysical Parameter Tester Main Technical Parameters
1. Thermal conductivity range: 0.015-10w/m · k (or 0.035-20w/m · k)
2. The constant power planar heat source method test can be completed, and the instrument provides testing under controllable experimental temperature conditions.
3. The instrument achieves digitalization and temperature measurement level better than 0.2, with automatic electronic compensation for room temperature;
4. Measurement accuracy ± 3%, accuracy ± 2%, repeatability ± 2%;
5. The measured heating power shall not be less than 35W ± 1%.
6. Tested automatically by the upper computer and tested the group data for 3 minutes under steady-state conditions.
7. It can display experimental parameters and curves, and achieve data printing and output.
8. Sample size: specimen 1:200 × 200 × 65mm; Test material 2: 200 × 200 × 22mm; Test material 3: 200 × 200 × 90mm.
The testing device consists of three parts: the specimen and specimen fixture, the heating system, and the data acquisition and processing of the microcontroller.
10. Experimental conditions: (1) The tested sample is uniformly isotropic and its physical properties are constant;
(2) The length and width of the sample are 8-10 times the thickness, indicating that the sample is semi infinite and has a uniform initial temperature;
(3) Constant power planar heat source;
(4) The heat capacity of the heater is zero.
11.. The system hardware consists of sensors, preamplifiers, channel control circuits, analog-to-digital conversion circuits, keyboard display and control circuits, print drivers and control circuits, microcontroller systems, system monitoring and backup protection circuits, system and heater power supplies, heaters, sample clamps, and other components.
12. Use AD590 integrated temperature sensor to compensate for the cold end of the thermocouple.
13. The analog-to-digital conversion circuit adopts a high-precision dual integration A/D converter.
14. The software system includes modules such as system management, data computation, printer management, parameter settings, data acquisition and filtering, thermocouple thermoelectric potential temperature conversion, interrupt handling, clock management, etc. By organically combining them according to a predetermined hierarchical structure through the system management module, various functions can be completed.